UFS
Micron on Wednesday introduced its first UFS 4.0-compliant storage devices. The company's latest generation of single-module smartphone storage devices are slated to be the fastest yet, offering a combination of improvements coming from the UFS specification itself, along with including newer, faster NAND within the storage devices. Micron expects its UFS 4 devices to be used by upcoming flagship smartphones, tablets, and ultra-low-power notebooks already this year. Micron's UFS 4.0 storage devices come in three capacities — 256 GB, 512 GB, and 1 TB — that rely on the company's own controller. The higher-end 512 GB and 1 TB UFS 4.0 products use Micron's 232-layer six-plane 1 Tb 3D TLC NAND devices and can provide sequential read speed of up to 4,300 MB/s as well...
Western Digital Reimagines HDD - Flash Integration with OptiNAND
The last few years have seen plenty of new innovations come up in the hard-disk drive market. For quite some time, the HDD technology roadmap was shared industry-wide -...
51 by Ganesh T S on 8/31/2021
Samsung Begins Mass Production of 512 GB eUFS 3.1 Storage: Up to 2.1 GB/s
Samsung has kicked off mass production of its new, high-performance eUFS 3.1 storage modules. Designed primarily with high-end smartphones in mind, the embedded storage drives offer some of Samsung's...
15 by Anton Shilov on 3/17/2020
Micron Develops uMCP with LPDDR5 & 96L 3D NAND for Midrange 5G Smartphones
Micron this week has announced that it has started sampling the industry’s first multichip package (MCP) that integrates LPDDR5-6400 DRAM and 96-layer 3D NAND flash memory. The uMCP5 device...
11 by Anton Shilov on 3/11/2020
UFS 3.1 Storage Devices for Smartphones Unveiled by Kioxia & Western Digital
Less than a month after JEDEC published its UFS 3.1 specification, Kioxia and Western Digital have introduced their first UFS 3.1-compliant storage devices for smartphones. Samples of Kioxia’s UFS...
2 by Anton Shilov on 3/2/2020
Faster, Cheaper, Power Efficient UFS Storage: UFS 3.1 Spec Published
JEDEC has published its UFS 3.1 specification (aka JESD220E), which adds several performance, power, cost-cutting, and reliability-related features to the standard. The new capabilities promise to increase real-world device...
11 by Anton Shilov on 1/31/2020
Kioxia Expands Automotive Grade eUFS Lineup: 512 GB for Extreme Conditions
Kioxia (formerly Toshiba Memory), has expanded its lineup of embedded UFS (eUFS) storage with a 512 GB device based on the company’s BiCS 3D NAND flash. The chip is...
5 by Anton Shilov on 11/15/2019
Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage
Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12...
30 by Anton Shilov on 10/24/2019
512 GB of UFS 3.0 Storage: Western Digital iNAND MC EU511
Western Digital said that it has now completed development and started sampling its first UFS 3.0 storage solutions for ‘5G era’ smartphones. The new embedded flash drives (EFDs) provide...
6 by Anton Shilov on 2/25/2019
Samsung Starts Production of 1 TB eUFS 2.1 Storage for Smartphones
Samsung said it had started mass production of its eUFS 2.1 storage solution featuring a 1 TB capacity for smartphones. Apart from its massive capacity, the drive offers a...
23 by Anton Shilov on 1/30/2019
Toshiba Begins to Sample UFS 3.0 Drives: 96L 3D TLC NAND, Up to 2.9 GB/s
Toshiba said late on Tuesday that it had started to sample its first UFS 3.0 storage solution. The device is aimed at mobile applications and promises to offer performance...
0 by Anton Shilov on 1/23/2019
UFS - USB Bridge Controllers for Card Readers, Hosts Incoming from JMicron & SMI
The JEDEC published the UFS Card 1.0 specification back in mid-2016, and shortly after that Samsung introduced its UFS cards with 32, 64, 128, and 256 GB capacities. In...
5 by Anton Shilov on 6/13/2018
Samsung Begins Mass Production of 256 GB eUFS Devices for Automotive Applications
Samsung has announced that it has started mass production of eUFS 2.1-compatible storage devices for automotive applications. The new 256 GB devices support select UFS 3.0 features for vehicles...
6 by Anton Shilov on 2/12/2018
JEDEC Publishes UFS 3.0 Spec: Up to 2.9 GB/s, Lower Voltage, New Features
JEDEC this week published their UFS 3.0 specification, which is intended to bring numerous performance, power and feature set-related improvements to the standard. The version 3.0 of the spec...
20 by Anton Shilov on 1/31/2018
Toshiba Samples eUFS Devices for Vehicles: Extended Temps & Reliability Features
Toshiba this month announced that it had started sample shipments of the industry’s first automotive grade embedded UFS storage devices for ADAS and infotainment systems. The new eUFS chips...
15 by Anton Shilov on 12/18/2017
Samsung Starts Production of 512 GB UFS NAND Flash Memory: 64-Layer V-NAND, 860 MB/s Reads
Samsung on Tuesday announced that it had initiated volume production of UFS NAND flash memory chips with 512 GB capacity based on its latest 64-layer 512 Gb V-NAND. The...
11 by Anton Shilov on 12/5/2017
Toshiba Samples New UFS 2.1 NAND: Up to 900 MB/s Reads For 2018 Smartphones
Toshiba has announced that it had started sample shipments of its latest UFS storage devices based on its 64-layer BICS3 3D TLC NAND memory. The new devices are compliant...
12 by Anton Shilov on 12/4/2017
Samsung Rolls Out Its First UFS Cards: SSD Performance in Card Form-Factor
Samsung today introduced the world’s first flash memory cards in UFS form-factor. The cards are compliant with the UFS Card 1.0 specification and offer performance comparable to that of...
38 by Anton Shilov on 7/7/2016
Samsung Announces 256GB UFS Embedded Storage Solution
Interestingly enough, we’re seeing something of a division in the mobile storage space, as it seems that some OEMs are focusing their efforts on UFS for internal storage, while...
23 by Joshua Ho on 2/25/2016
Samsung Announces 128GB UFS Storage For Smartphones
We've first heard about plans to adopt UFS (Universal Flash Storage) with the announcements of Toshiba and Qualcomm reported over a year ago. While the promised late 2014 schedule...
31 by Andrei Frumusanu on 2/25/2015
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