Semiconductors
One of the core challenges that Rapidus will face when it kicks off volume production of chips on its 2nm-class process technology in 2027 is lining up customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away from its more established rivals. To that end, the company thinks they've found their edge: fully automated packaging that will allow for shorter chip lead times than manned packaging operations. In an interview with Nikkei, Rapidus' president, Atsuyoshi Koike, outlined the company's vision to use advanced packaging as a competitive edge for the new fab. The Hokkaido facility, which is currently under construction and is expecting to begin equipment installation...
ASML to Ship Multiple High-NA Tools in 2025, Expands Production Capacities
ASML began to ship its first High-NA lithography tool to Intel late last year ,and the machine will be fully assembled in Oregon in the coming months. Shipping only...
8 by Anton Shilov on 2/14/2024
Global Semiconductor Sales Hit $526.8 Billion in 2023
The global semiconductor industry saw its sales dropped around $47 billion to nearly $527 billion in 2023, according to estimations by the Semiconductor Industry Association (SIA). This was a...
13 by Anton Shilov on 2/9/2024
TSMC to Build Second Fab in Japan: 6nm and 7nm Coming to Japan
Taiwan Semiconductor Manufacturing Co. on Tuesday formally announced plans to build a second fab in Japan. The fab will be run by Japan Advanced Semiconductor Manufacturing (JASM), a majority-owned...
4 by Anton Shilov on 2/6/2024
Intel Teams Up with UMC for 12nm Fab Node at IFS
Intel and UMC on Thursday said they had entered into an agreement to jointly to develop a 12 nm photolithography process for high-growth markets such as mobile, communication infrastructure...
12 by Anton Shilov on 1/25/2024
Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts Operations
Intel this week has started production at Fab 9, the company's latest and most advanced chip packaging plant. Joining Intel's growing collection of facilities in New Mexico, Fab 9...
2 by Anton Shilov on 1/25/2024
TSMC 2nm Update: Two Fabs in Construction, One Awaiting Government Approval
When Taiwan Semiconductor Manufacturing Co. (TSMC) is prepping to roll out an all-new process technology, it usually builds a new fab to meet demand of its alpha customers and...
38 by Anton Shilov on 1/19/2024
TSMC Posts Q4'23 Earnings: 3nm Revenue Share Jumps to 15%, 5nm Overtakes 7nm For 2023
Taiwan Semiconductor Manufacturing Co. released its Q4'2023 and full year 2023 financial results this week. And along with a look at the financial state of the firm as it...
2 by Anton Shilov on 1/19/2024
Synopsys to Acquire Ansys: Set to Offer EDA, Analysis, and Simulation Tools
Synopsys on Tuesday announced that it had reached a definitive agreement to acquire Ansys in a deal valued at $35 billion. Synopsys specializes primarily on electronic design automation (EDA...
0 by Anton Shilov on 1/16/2024
ASML's First High-NA EUV Litho Scanner Arrives At Intel [UPDATED]
Update 1/5/2024: Intel Oregon announced on Thursday that it has received its shipment of ASML's first-generation Twinscan EXE:5000 High-NA EUV lithography scanner. The two companies will start assembly process...
28 by Anton Shilov on 1/5/2024
Intel Reiterates: We Are Not Going to Spin Off IFS
When Intel struggled with its 10nm process technology a few years ago, some investors suggested that the company would be better-off spinning its chip production into an independent foundry...
42 by Anton Shilov on 12/15/2023
TSMC Solidifies Leadership on Foundry Market as Intel Jumps into Top 10
The global foundry industry witnessed a substantial rise in demand in the third quarter of 2023, according to TrendForce. The Top 10 foundries collectively saw their revenue soar to...
7 by Anton Shilov on 12/6/2023
Amkor to Build $2 Billion Chip Packaging Fab in Arizona Primarily for Apple
Amkor, the world's second largest independent outsourced semiconductor assembly and test (OSAT) service provider, has announced their intention to build a new advanced chip packaging facility in the U.S...
12 by Anton Shilov on 12/4/2023
Samsung's Next-Gen 3nm and 4nm Nodes on Track for Mass Production in 2H 2024
Samsung is set to start making chips using its 2nd Generation 3nm-class (SF3) manufacturing technology as well as performance-enhanced version of its 4nm-class (SF4X) fabrication process in the second...
9 by Anton Shilov on 11/2/2023
TSMC Q3 Earnings: 3nm Production Node Accounts for 6% of Revenue
Although Taiwan Semiconductor Manufacturing Co. formally started production of chips using its N3 (3nm-class) process technology back in late 2022, the company did not recognize any meaningful N3 revenue...
7 by Anton Shilov on 10/19/2023
Canon Prepares Nanoimprint Lithography Tool To Challenge EUV Scanners
Canon has recently revealed its FPA-1200NZ2C, a nanoimprint semiconductor manufacturing tool that can be used to make advanced chips. The device uses nanoimprint lithography (NIL) technology as an alternative...
14 by Anton Shilov on 10/17/2023
TSMC: We Want OSATs to Expand Their Advanced Packaging Capability
Almost since the inception of the foundry business model in the late 1980s, TSMC would produce silicon. In contrast, an outsourced semiconductor assembly and test (OSAT) service provider would...
2 by Anton Shilov on 10/16/2023
TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion
Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC's roadshow was dedicated to the next generation of...
20 by Anton Shilov on 10/12/2023
Samsung Lines Up First Server Customer For 3nm Fabs
Although Samsung Foundry was the first contract fab to formally start mass production of chips on a 3 nm-class process, so far, the company's latest process has largely been...
5 by Anton Shilov on 10/12/2023
TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips
This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry's suppliers, partners, and customers to help TSMC's customers better...
4 by Anton Shilov on 10/12/2023
GlobalFoundries Applies for CHIPS Money to Expand U.S. Fabs
Update 9/30: Correcting the number of companies interested in receiving support from the CHIPS fund. GlobalFoundries has applied for financial support from the U.S. CHIPS and Science Act to expand...
3 by Anton Shilov on 9/26/2023
Facebook
Twitter
RSS
