Aquabolt

Samsung this week announced that it had started mass production of its second-generation HBM2 memory code-named “Aquabolt”. The new memory devices have 8 GB capacity and operate at 2.4 Gbps data rate per pin. To hit the new data rate, Samsung had to apply new technologies related to TSV design and thermal control. Samsung intends to offer the new memory to customers for use in next-gen HPC, AI and graphics solutions. General architecture of Samsung’s new 8 GB HBM2 “Aquabolt” memory is similar to the company’s previous-gen 8 GB HBM2 “Flarebolt” devices: each KGSDs (known good stacked die) is comprised of eight 8-Gb memory ICs (integrated circuits) interconnected using TSVs (through silicon vias) in an 8-Hi stack configuration. Every KGSD features a 1024-bit bus and...